Max Heated Bed Temperature |
F250: 100°C F350: 80°C
|
Layer Resolution |
50 - 300 microns
|
Nozzle Diameter |
0.4 mm
|
Max Nozzle Temperature |
275°C
|
Supported Materials |
PLA, ABS, PETG, TPU, wood filled PLA, more being tested
|
Frame Materials |
Aluminuim Alloy
|
Data Transmission Methods |
Wi-Fi, USB cable, USB flash drive
|
Touchscreen Specs |
5 in., Android OS, Quad-core 1.1 GHz ARM Cortex-A7
|
Supported Software |
Snapmaker Luban or third-party software
|
Supported File Types |
.stl, .obj, more formats to be added
|
Supported OS |
macOS, Windows, Linux
|
Rated Power |
320 W |