| Max Heated Bed Temperature |
F250: 100°C F350: 80°C
|
| Layer Resolution |
50 - 300 microns
|
| Nozzle Diameter |
0.4 mm
|
| Max Nozzle Temperature |
275°C
|
| Supported Materials |
PLA, ABS, PETG, TPU, wood filled PLA, more being tested
|
| Frame Materials |
Aluminuim Alloy
|
| Data Transmission Methods |
Wi-Fi, USB cable, USB flash drive
|
| Touchscreen Specs |
5 in., Android OS, Quad-core 1.1 GHz ARM Cortex-A7
|
| Supported Software |
Snapmaker Luban or third-party software
|
| Supported File Types |
.stl, .obj, more formats to be added
|
| Supported OS |
macOS, Windows, Linux
|
| Rated Power |
320 W |
